Development of Transfer-Printed III-V C-Band Lasers on Silicon Photonic Integrated Circuits for Multi-Project Wafer Offering

Integrating optical gain media remains a significant challenge in silicon photonics. This work demonstrates the hybrid integration of C-band lasers into the AIM Photonics 300 mm multi-project wafer foundry platform by micro-transfer printing. Micro-transfer printing is a thin film, wafer-scale, pick-and-place technique that requires lasers to be fabricated with an etch release layer to free the device from the III-V substrate. The source lasers and the target cavity on the silicon photonics integrated circuit required co-process development to enable a butt-coupled integrated package. Laser powers of $\boldsymbol{\sim} \mathbf{0. 5}$ milliwatts were coupled into the photonic circuit.