Optical Multi-Chip Interconnect Bridge (OMIB™) Interposer Assembly Process to Enable High-Density Photonic Interconnects for High-Performance Computing Applications

As next-generation high-performance computing applications drive complex heterogeneous integration schemes that are currently limited by beachfront of the XPU, further scaling is highly dependent on co-packaged optics solutions. Photonic Fabric ${ }^{\text {TM }}$ has emerged as a pioneering optical compute and memory fabric solution for scale-up networking. Photonic Fabric provides several orders of magnitude better performance when compared to traditional Co-Packaged Optics (CPO) because it has no beachfront limitations and can deliver data directly to the point of compute in the XPU. In this paper, we present a novel Optical Multi-chip Interconnect Bridge (OMIB™) organic interposer assembly process to integrate XPUs with electrical and optical bridges. OMIB is a key building block in the Photonic Fabric platform for accelerated computing. The key enabler is a through-mold optical assembly compatible with organic interposer assembly process. In this paper, we discuss the OMIB package architecture concept, the organic interposer assembly process flow, and substrate assembly. Process characterization results will be presented along with preliminary optical characterization.