Software-Defined Power Integrity (PI) Analysis for 2.5D/3D Packages

The power integrity of package design is becoming increasingly critical as packaging technology advances towards higher density, larger sizes, and greater power consumption, especially for 2.5D/3D packages. Traditional power integrity design often does not consider die/bump-level instantiation, leading to inaccurate power noise predictions. Additionally, perpin based die model and package model extraction leads to complicated and excessive effort. In this paper, we propose a practical power distribution network (PDN) modeling methodology that incorporates nonuniform die-level instantiations and integrates die, interposer, package, and onpackage decoupling capacitors for accurate and time-saving power integrity model extraction, analysis, and optimization under different software configurations. We demonstrate cases on package PDNs for 2D and 2.5D/3D dies with CoWoS interposers.