Enabling 20 Tb/s/mm Die-to-Die Bandwidth Density with Advanced Packaging Technologies

In this paper, we explore novel solutions that can provide more than 20 Tb/s/mm on-package die-to-die input/output (I/O) bandwidth density using advanced packaging technologies. We present the primary enablers that facilitate the doubling of signaling speed, reaching up to 64 Gb/s. Additionally, we examine the importance of package technology density scaling in achieving the aforementioned bandwidth density, while ensuring the longterm scalability of power area consumption.