First Demonstration of Metal-Lidded Integral Microjet Impingement on-Chip Cooling Structures with Alternating Feeding and Draining Nozzles for High-Performance Interposer Packages

This study experimentally demonstrates the assembly and integration capability of a lid-compatible manifold cooler on the NVIDIA V100 GPU platform. A thin and compact cooling solution with alternating feed and drainage channels is designed to efficiently manage the thermal load generated by both the logic chip and high-bandwidth memory. The thermal performance of the manifold is evaluated using a simulated heater assembly with water as the working fluid. The cooling system effectively dissipates thermal design power above 300 W, up to 400 W at a flow rate of 4 LPM. The thermal-hydraulic performance of this system is evaluated using thermal resistance, steady-state temperature, and pressure drop measurements. The cooler maintains good surface temperature uniformity, with temperature variations of less than $3^{\circ} \mathrm{C}$ even at a thermal design power (TDP) of 300 W. In addition, a leak test is performed on the actual V100 GPU chip and manifold assembly to ensure system adaptability. This cooling strategy enables the creation of more powerful and compact computing systems by improving heat dissipation at the chip level, hence supporting the next generation of highperformance computing technology.