Modeling and Validation of an Integrated Package Solution (Ipas) for Next Generation Power Supply Systems

A circuit model for a novel capacitor array sheet called integrated Package Solution (iPaS) has been validated. The results of the impedance simulation using a parallel interconnected model which added lateral electrical connections of the capacitor array sheet have been accurately matched with those of the actual sample over wide range. In addition, the transient response characteristics of the power delivery network (PDN), which consists of iPaS embedded substrate, a load module, and an evaluation board, also have been confirmed that the simulation results using this circuit model replicated the actual device with high accuracy. This study makes it possible to design a complex and advanced PDN with iPaS embedded substrate, providing a new option for the realization of nextgeneration power systems.