Examination and Simulation of a High-Cycle Fatigue Tester for Accelerated Stress Testing with Simplified Cantilever Specimens for Fracture-Mechanical Interface Characterization

We present a high-cycle fatigue (HCF) test designed for the accelerated stress testing of metallization layers and bi-material interfaces in microelectronic packages under controlled periodic displacement amplitudes and isothermal conditions. The primary objective of this study is to examine the delamination of bi-material interfaces. The samples utilized for testing are manufactured on a magnetic steel substrate, employing the same processes employed in the production of the microelectronic packages to be tested. A range of methodologies have been developed for sample preparation. To excite the sample, we use magnetic actuation. The sample is subjected to oscillation from a cyclic load, allowing for several million oscillation cycles in a short time. The change in crack length can be determined using a stiffness method by capturing changes in the beam's vibration spectrum. Besides this method of crack measurement, crack progression can also be calculated from the measurement of the bending line. This stress method enables the rapid testing of the integrity of microelectronic components under harsh conditions.