Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing

The degradation of electroplated copper metallization under short circuit power pulsing is driven by a complex interplay of localized deformation, thermomechanical stresses, and time-dependent creep effects. This study introduces a microstructure-sensitive finite element model to simulate these degradation effects, incorporating thermomechanical coupling, anisotropic plasticity, and timedependent creep phenomena. The simulation results align with experimental observations and demonstrate the significance of grain boundary-related mechanisms in stress localization. The proposed model serves as a predictive tool for evaluating metallization reliability under extreme loading conditions.