A 3D Unified Analysis Method (3D-UAM) for Wafer-on-Wafer Stacked Near-Memory Structure

The wafer-on-wafer (WoW) stacked structure exhibits pioneering advantages in near-memory computing but encounters challenges in 3D analysis due to the miniaturization of vertical connection structures and the simplification of vertical drivers. This article introduces a 3D unified analysis method (3D-UAM), which facilitates standard-cell-level signal integrity (SI) analysis across the 3D WoW stacked structure with hybrid processes, including a comprehensive 3D vertical connection theoretical model that bridges the dynamic random access memory (DRAM) and logic netlists. The accuracy of the 3D-UAM is confirmed through consistency analysis with the results of the 3D field model. The authenticity of the 3D-UAM is validated through correlation analysis with the physical test results from the WoW stacked DRAM test chip. The practicality of the 3D-UAM is demonstrated through channel optimization on a 20-layer DRAM WoW structure and power integrity (PI) analysis for the WoW stacked structure.