3D Miniaturization of Magnetic-Assisted Capsule Endoscope Using Mass-Transfer Cu Pillar Pin Assembly and Vacuum Printing Encapsulation

To further improve patients' swallow ability and simplify the assembly complexity, a dense mass transfer of fine and high aspect ratio Cu pillar pins and a vacuum printing encapsulation (VPE) are developed to achieve a 3D system-in-package (SiP). Compared with the 1^st generation design with rigid-flex SMT and folded assembly, the radius of newly developed magnetic-assisted capsule endoscope can be shrunk from 9.9mm at down to 8.5mm and the length is shortened from 25.5mm to 24.0mm. This is equivalent to shrinking the capsule from size “000” down to size “00”.