Simulation of Signal Integration and Power Integration in Advanced Packaging Circuit Design

The evolution of advanced packaging technologies has paved the way for greater efficiency in integrating and miniaturizing electronic components. Fan-out panel-level packaging (FOPLP),coupled with redistribution layer (RDL) technology represents a key innovation in this domain. This study explores signal integrity (SI) and power integrity (PI) in two packaging scenarios one involving a combination of FOPLP and ball grid array (BGA) packaging and another utilizing a three-layer RDL structure. Using Allegro PCB Designer for layout and ANSYS HFSS and SIwave for simulations, the impact of shielding layers mesh structures, and grid sizes on signal transmission and electromagnetic interference (EMI) was evaluated. Findings revealed that mesh shielding offers a superior balance between SI and EMI mitigation, particularly with larger grid openings. Furthermore, power distribution network (PDN) analysis demonstrated that optimized designs effectively maintain IR-drop and power loss within acceptable limits.