Cool3D: Cost-Optimized and Efficient Liquid Cooling for 3D Integrated Circuits

CMOS scaling faces challenges due to lithography and device physics issues, leading to increased costs and difficulties in expanding chip footprint. 3D integration technology offers increased integration density without increasing footprint, but elevated power density makes heat dissipation a significant challenge. Microchannel cooling effectively removes heat inside 3D chips. Traditional microchannel optimizations typically focus only on minimizing pump power within a limited parameter design space, leading to suboptimal cooling efficiency. Moreover, existing research rarely considers manufacturing costs, limiting practical application. To address these issues, we propose a high-dimensional non-uniform microchannel design scheme based on Segmented Sampling Bayesian Optimization (SSBO). This multi-parameter collaborative optimization framework comprehensively optimizes microchannel design. Our method reduces pump power by 70% compared to limited parameter design spaces. Additionally, we introduce a cost model for microchannel design, formulating a multi-objective optimization problem that considers both manufacturing cost and pump power consumption. By solving the multi-objective optimization problem by searching for the Pareto front, we demonstrate a balanced design between microchannel manufacturing cost and pump power and provide guidelines for key design parameters.