A Comprehensive Inductance-Aware Modeling Approach to Power Distribution Network in Heterogeneous 3D Integrated Circuits

Heterogeneous 3D integration technology is a cost-effective and high-performance alternative to planar integrated circuits (ICs). In this paper, we propose an on-chip power distribution network (PDN) modeling technique for heterogeneous 3D-ICs (H3D-ICs), which explicitly takes the effects of on-chip inductance into account. The proposed model facilitates efficient transient and AC simulations with integrated inductive effects, enabling accurate noise characterization at high frequencies and facilitating the exploration of early-stage PDN design. The model is validated via HSPICE simulations, demonstrating a maximum error below 1% and achieving average speedups of 1.5x in transient and 8.5x in AC simulations.