Crosstalk Analysis of MWCNT based Through Silicon Vias for Quaternary Logic Applications

This study investigates crosstalk in coupled through-silicon vias (TSVs) for quaternary logic circuits. Using an electrical equivalent circuit model and HSPICE simulations, the crosstalk (i.e., both functional and dynamic crosstalk’s) in TSVs with multi-walled carbon nanotubes (MWCNTs) as conductors and various polymer liners (polyimide, polypropylene carbonate (PPC) and benzocyclobutene (BCB)) is analyzed and compared to single walled CNT (SWCNT)-based TSVs. The power dissipation and PDP are also evaluated. The study finds that BCB-based coupled MWCNT TSVs significantly reduce crosstalk particularly at reduced TSV heights and improved overall performance compared to SWCNT-based TSVs. Therefore, MWCNT-based TSVs with BCB liners are deemed most suitable for quaternary logic integrated circuits.