Numerical Simulation of Void Growth in Electrical Solder Material

This paper deals with the void growth in electrical materials such as Sn-Ag-Cu solder for the electronic packaging. The small-sized Sn-Ag-Cu strip with a notch is analyzed using the finite element method. Under the electric load, the electromigration, thermo-migration, stress-migration and pure atomic diffusion are the driving forces for the void growth. As a result, the electro-thermo-structural-diffusion coupled-field are obtained. Due to the atomic migration, the void growth history is obtained using the element-birth-and-death simulation in ANSYS software. Furthermore, the electric resistance and time to failure of the Sn-Ag-Cu solder strip are determined for the electronic reliability and design.