Crack Catcher AI — Enabling Smart Fracture Mechanics Approach for Damage Control in Thin Silicon Wafers for 3D Semiconductor Integrated Devices/Packages

The importance of silicon cannot be undermined - in photovoltaics (PV) as well as in semiconductor industries. However, silicon is very brittle. Silicon cells/wafers crack easily during manufacturing assembly and/or during device operations. Crack Catcher AI uses novel smart fracture mechanics approach with Artificial Intelligence (AI) methodologies to predict and control crack/damage evolution in thin silicon cells/wafers. This is critical as semiconductor 3D integration technology calls for wafer-to-wafer bonding with utmost alignment accuracy and yield/reliability.