Reliability Analysis of MEMS Millimeter-Wave Micro-Transmission Line

The millimeter-wave micro-transmission line with GSG turning point is designed and prepared in this letter. The circuit breaking problem occurs in the initial measurement. Through the thermal stress analysis, material interface matching, and process improvement, the tested insertion loss at 40 GHz is 0.2 dB/cm, and the reflection loss is better than 17.32 dB. After three thermal reflow at $220~^{\circ }$ C and 500 h high-temperature storage at $150~^{\circ }$ C, there is no obvious difference between the performance tests before and after. It shows that the structure stability of the millimeter wave micro-transmission line is very good, which provides a reference solution for the key technical problems in the preparation process of micro-transmission line and reliability verification.