Phononic Integrated Circuit Component Design and Analysis for Surface Acoustic Waves in ScAlN on Silicon Carbide

This work presents a two-fold study on the numerical modeling and experimental demonstration of phononic components using surface acoustic waves (SAWs) in 30% scandium aluminum nitride (ScAlN) thin films on silicon carbide (SiC). Compact phononic integrated circuits (PnICs) enabled by focusing interdigitated transducers (FIDTs) in slow-on-fast piezoelectric platforms offer a promising approach for signal processing by exploiting acoustic wave manipulation. Key working principles, including acoustic waveguiding with three-dimensional confinement, bending, splitting, and coupling, are demonstrated to advance the development of PnICs, facilitating the creation of compact, efficient devices for signal processing applications. [2024-0205]