Chip-level Packaged Electrochemical Angular Accelerometer with a Wide Measurement Range

This paper presents a novel approach to realize an electrochemical angular accelerometer with a compact size and a wide measurement range. For the first time, anodic bonding technology was utilized to create a chip-level packaged MEMS electrochemical angular accelerometer with a compact glass-silicon-glass triple layer structure, consisting primarily of a silicon-on-glass (SOG) wafer for angular acceleration sensitivities and a glass cap to form a toroid microchannel. To realize a wide range of angular acceleration measurements, the novel asymmetric planar electrodes with expanded cathode width and inter-cathode space were deployed on the silicon layer of the SOG wafer to improve the ion reaction of the cathodes more thoroughly. Besides, a narrower flow channel structure was achieved through the glass cap with a cavity to increase flow resistance. Testing results indicated that it has a more comprehensive measurement range (up to 500°/s²) and a much higher dynamic range(-130dB@1Hz), marking a notable advance over its previously reported equivalents. This study presents an innovative method for creating electrochemical angular accelerometers, which are specifically designed to measure rotational motion with substantial angle variations.