Optical Setup for Laser-Assisted Bonding With Through-Silicon Microscopy Capabilities

The modern processes for photonic integration impose stringent demands on the design and functionality of high precision bonding assembly setups. In this study, we present the development of a laser-assisted bonding (LAB) setup employing bottom irradiation/illumination architectures. The main goal is to demonstrate through-silicon imaging capability enabling alignment of photonic waveguides during the LAB process. The imaging is achieved with a novel optical set-up used also for the simultaneous irradiation laser beam delivery. A proof-of-concept LAB integration of a III/V chip to silicon photonic (SiPh) integrated circuit is demonstrated.