Fast Heatsink Topology Optimization for RF Power Amplifier Chip Heat Dissipation Enhancement

This article proposes a fast topology optimization algorithm methodology for the design of heatsinks for RF power amplifier circuits based on a thermal resistance network model. This methodology can achieve heatsinks lightweight design while keeping the temperature within an allowable range. The solid isotropic materials with punishments (SIMPs) method is applied within the design area of the heatsink, while the impact of the RF power amplifier circuit on heat dissipation is represented by a thermal resistance network model. The main advantage of this methodology is that it avoids the use of conventionally employed finite element method (FEM) thermal simulation of the whole chip/heat dissipation structure, which requires very long simulation time and high computational effort. On the contrary, the thermal resistance network calculation method offers a very fast and sufficiently accurate temperature distribution analysis tool, speeding up the heatsink structure design when employed within the optimization routine. Compared with a traditional heatsink, the volume (mass) of the heatsink optimized through the aforementioned method has been reduced of more than 20% while satisfying the highest temperature requirements.