System for Detecting Warpage Deformation in Printed Circuit Boards Based on Digital Image Correlation

To address the issue of warpage deformation in printed circuit boards due to design flaws, high temperatures, or external forces during manufacturing and usage, establish a detection system based on digital image correlation. Digital image correlation was used to detect the deformation of printed circuit boards, resulting in the determination of the three-dimensional overall deformation and surface strain distribution of printed circuit boards. Furthermore, deformation patterns of printed circuit boards were analyzed to provide a technical reference for production and usage.