Digital Twins for IC Packages and Electronics-enabled Systems

Digital Twin (DT) is a key technology in Industry 4.0 and has been embraced by several industries, including manufacturing, automotive, and electronics. With the ever-increasing complexity of electronics packaging, Digital Twins are even more relevant as they offer a revolutionary approach by enabling real-time monitoring, analysis, and optimization. There are several contextualized definitions and application-specific interpretations of DT that don’t necessarily clarify the reach of the concept. This paper presents an overview of the concept evolution, its architecture, and the workflow of a Digital Twin system. Then, the five-dimensional model of DT is further expanded for the microelectronics domain, and its implementation in six related applications representing different aspects of IC packages and electronics-enabled systems is elaborated on. Finally, the present relevance, challenges, and future scope of the Digital Twin technology are discussed.