Signal Pin Push Test Method Calibration for Soldering Interconnection Qualification in Power Packaging

In power modules, the signal pins conduct control signals between the control unit and power circuit. Thus, the interconnection quality of signal pins needs to be examined for more reliable circuit control. The existing procedure for qualifying the interconnection is to perform a standard shear test on pin holder to detect undesired defects, which is a destructive testing process that can only be done during the manufacturing process. The main purpose is to introduce a new signal pin push test method as a non-destructive examining process after the whole production process for replacing the existing one. In this paper, FEM simulation was performed with the signal pin structure including pin, pin holder, and welding solder. The two testing methods were both simulated and calibrated with experimental results. By the comparison of stress and strain status in the solder interconnection layer, the test load ranges of the two methods are correlated. Then, with a given loading limit of the previous method, the corresponding limit value can be evaluated for the new signal pin push test based on the correlation.