III-V Laser Diode Flip Chip Bonding on Photonics Integrated Circuit with AgSn Solder

Heterogeneous integration is an efficiency way to integrate III-V laser diode on the silicon-based photonics integration circuit. To provide the III-V laser diode flip-chip bonding solution with cost-efficiency processes and laser diode integration location freedom feature, the cost-efficiency AgSn solder is used and the cavity-based laser diode mounting structure is developed on the photonics integration circuit (PIC). After laser flip-chip bonding, the III-V laser diode is turned on successfully and preliminary reliability is verified. The electric connection line power delivering efficiency is around 90 %.