Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs

This paper presents a comprehensive frequency analysis of copper-carbon nanotube (Cu-CNT) composite cells in stacked through-silicon vias (TSVs), focusing on a novel approach in which Cu-CNT composite cells are distributed normally within the TSVs. This distribution is designed to simulate real-world conditions and enhance the reliability of the findings. The key contributions of this work encompass a comprehensive assessment of insertion and return losses related to electrical characteristics of stacked Cu-CNT TSVs, varying critical factors such as frequency and material composition to evaluate the system performance. Also the eye diagrams are investigated at various data rates, which shed light on the signal quality and integrity for high-speed applications. The findings show that Cu-CNT composites outperform conventional copper-based TSVs in terms of performance metrics, drawing attention to their promise as next-generation, high-density interconnects for 3D integrated circuits.