Abstract:
This paper introduces the new generation CIPOS™ Mini family. It, is an intelligent power module (IPM) dual in-line package with transfer molding for 3-phase AC motors, an...Show MoreMetadata
Abstract:
This paper introduces the new generation CIPOS™ Mini family. It, is an intelligent power module (IPM) dual in-line package with transfer molding for 3-phase AC motors, and permanent magnet motors in variable speed motor drives applications. This IPM integrates 650 V rated IGBT7, emitter controlled (EC7) diodes, a 6-channel silicon-on-insulator (SOI) gate driver, and protection circuit in a dual in-line, full-pack transfer-molded package. It uses the 7th generation TRENCHSTOP™ IGBTs and diodes with micro-pattern trench technology that, offers reduced losses, improved efficiency, and higher power density compared to previous versions.
Date of Conference: 03-06 November 2024
Date Added to IEEE Xplore: 10 March 2025
ISBN Information: