Real-Time Image Processing Applications in Automatic BGA Inspection System

With the rapid advancement in wafer packaging technology, especially the surging demand for chips, enhancing product quality and process efficiency has become increasingly crucial. This article delves into the automatic detection of pins on Ball Grid Array (BGA) within wafer packaging processes. This system is engineered with a flexible software and hardware architecture to address evolving industrial requirements, facilitating swift adaptation to new processing standards and technological demands. By utilizing Programmable Logic Controller (PLC) to control a three-axis gantry slide combined with industrial camera imaging technology, this system achieves high efficiency and precise positioning, thereby delivering high-quality image. This article utilizes YOLOv10 image processing technology and machine learning algorithms to effectively achieve accurate identification and classification of BGA defects. The YOLOv10 is chosen for its outstanding recognition capabilities and swift processing speed, enabling the rapid and accurate identification of minor defects, such as bent pins, missing pins, and solder ball defects. Through large image analysis, this system has been proven to enhance detection accuracy and reduce errors of manual detection. This article primarily addresses issues in semiconductor manufacturing processes and improves the product yield rate in current production lines. By effectively integrating AI-based detection technology into semiconductor manufacturing, it replaces labor-intensive tasks, enhancing efficiency and precision.