Room Temperature Polymer-Based Hybrid Bonding Scheme for 3D Integration and Advanced Packaging

This study presents a room-temperature polymer-based hybrid bonding scheme, designed to address the limitations of conventional high-temperature bonding methods in three-dimensional (3D) integration. By performing bonding at room temperature followed by a post-annealing process, the bonding method achieves excellent and reliable bonding results with minimal thermal impact, as it avoids the higher temperature requirements common in conventional polymer-based hybrid bonding, which is advantageous for temperature-sensitive components. SEM and shear test results demonstrate outstanding bonding quality and bonding interface, achieving a bonding strength of 55.58 kgf/cm2. The electrical properties demonstrate stable performance across 1000 cycles of thermal cycling tests (TCT). The proposed room temperature polymer-based hybrid bonding scheme thus provides a viable alternative to conventional dielectric bonding methods, addressing critical challenges in the potential of room-temperature polymer-based hybrid bonding for three-dimensional integration applications.