From Packaging to Converter: A High Power Density Power Converter Based on Direct Cooling Chip-on-Ceramic Heatsink Packaging

The increasing demand for lower size and higher conversion efficiency is posing new challenges, driving the adoption of innovative technologies in power electronics. Specifically, addressing the thermal management of the power module and optimizing the size of the dc-link capacitor are crucial steps for enabling power devices to achieve high power density and superior reliability in converters. This paper introduces a ceramic-enabled power converter featuring an 800 V, 10 kW SiC power converter that achieves a power density of 60 kW/L, It offers a comprehensive examination of the design, implementation, and experimental validation of a three-phase SiC power inverter, encompassing aspects from packaging to converter functionality, and incorporating ceramic heatsinks and capacitors. At the packaging level, SiC-on-ceramic heatsink packaging is employed to enhance thermal performance and reliability. At the dc-link level, a ceramic capacitor is utilized to minimize the size of the dc-link capacitor. The PLECS simulation results indicate an efficiency of 98.9% at 50 kHz switching frequency and rated power. Additionally, the continuous experimental results show that the power converter operates successfully at the designed voltage and power levels, demonstrating the feasibility of the proposed converter design methods.