Design of Metamaterial High-Temperature Pressure Sensor Based on HTCC Ceramic Substrate

A substrate-integrated waveguide wireless passive temperature and pressure sensor, featuring an integrated metamaterial structure, has been developed to meet the stringent sensing requirements for temperature and pressure in aerospace and other high-performance applications. A comprehensive analysis of the operational mechanism, combined with the development and optimization of a simulation model using advanced tools such as HFSS, has demonstrated the substantial potential of this sensor for temperature and pressure monitoring. The fabrication process involved precise ceramic cutting, punching, screen printing, and high-temperature sintering, ensuring robust and reliable performance. A dedicated test platform was established to rigorously evaluate the sensor’s performance characteristics. The sensor successfully detected temperatures across a wide range from 25 °C to 1200 °C, with a temperature sensitivity of 145.83 kHz/°C between 25 °C and 400 °C, and an enhanced sensitivity of 248.05 kHz/°C from 400 °C to 1200 °C. In addition, the sensor was capable of measuring pressures from 0 to 800 kPa at room temperature, with a pressure sensitivity of 103.52 kHz/kPa. These results highlight the sensor’s potential for use in harsh environments and demanding applications.