Enhancing AOI with AI for Printed Circuit Board Assembly – A Comprehensive Industry Study

The integration of Artificial Intelligence (AI) with Automated Optical Inspection (AOI) systems holds significant potential for improving the accuracy and efficiency of defect detection in Printed Circuit Board Assembly (PCBA). This paper presents the findings of an industry-wide study conducted by the International Electronics Manufacturing Initiative (iNEMI) on the adoption and enhancement of AI in AOI systems. Building on the results of Phase 1, which established performance metrics and identified key challenges, Phase 2 involved experimental evaluations to provide industry-wide recommendations. The study highlights the benefits, challenges, and future directions for AI-enhanced AOI systems.