Multi-Layer Organic Substrate-Based SiC Full-Bridge Module for a Power Electronics Building Block

With the advancement of wide bandgap (WBG) technology, a new world of high-power, high-frequency converters is possible. To fully benefit from WBG technology, the packaging aspect of power modules becomes critical in improving electrical and thermal performance. This paper covers the design and characterization of a full-bridge power module based on organic substrates for the Integrated Power Electronics Block (iPEBB). The 1.7 kV, 100 A full-bridge module uses state-of-the-art organic substrates to form a large area, multi-layer design to reduce power loop inductance (3 nH) and contain common-mode (CM) noise with a screening layer. Experimental results show a voltage overshoot of less than 7% and an Rth,jc of less than 0.7 °C/W. Soft-switching tests confirm functionality at 1 kV, 500 kHz, enabling future use in iPEBB.