Maximally PCB-Space-Saving Hybrid Integration of Millimeter-Wave and Microwave Antennas for 5G and B5G Smartphones

This paper proposes a simple, low-cost, and practical hybrid integration design of a 5G FR2 millimeter-wave antenna module based on a thin flexible printed circuit (FPC) and a 5G FR1 microwave antenna based on a metal frame to maximally save precious printed circuit board (PCB) space for more competitive 5G and beyond 5G (B5G) smartphones. The thin FPC-based millimeter-wave antenna module consists of a $1\times 4$ millimeter-wave antenna array (embracing the 3GPP 5G band n261 and maximally steering to 45°), an IC shielding case, and a connector. The whole millimeter-wave antenna module is integrated to a metal cantilever extending from the metal frame (as a microwave antenna) serving as the carrier for the millimeter-wave antenna module. Due to the cantilever carrier, no PCB space will be occupied so that the PCB space utilization can be maximized. The integrated microwave antenna can well embrace plenty of 3GPP 5G bands, e.g., n7, n12, n14, n18, n20, n28, n29, n38, n41, n83, n89, n90, and the 2.4 GHz WLAN band. As a result, this presented hybrid antenna integration scheme is a compelling total solution of millimeter-wave and microwave antennas for more advanced 5G and B5G handsets. Also, simulated and measured performance of the integrated millimeter-wave and microwave antennas shows good agreement.