An RF Signal Amplification and Power Detection 3D System-in-Package (SIP) Design Based on HDI Technology

This paper presents a 3D SIP (system in package) design of four-channel power detection and signal amplification. It used HDI(High-Density Interconnect) technology to vertically interconnect different MMIC(monolithic microwave integrated circuits), which has been validated to have minimum impact on its performance. The proposed 3D-SIP has been highly integrated into a volume of 2.05mm × 1.6mm × 0.4mm with BGA(ball grid array) output and input, the maximum receive gain is 11.3 dB at 16Ghz.