UCIe Standard: Enhancing Die-to-Die Connectivity in Modern Packaging

Today, packaging plays a crucial role in determining chip performance in systems. As transistor sizes shrink and chip sizes grow to meet increasing processing demands, wafer yield drops. Connecting smaller chips within a package or using multidie designs has gained attention as it improves yield, enables intellectual property reuse, enhances performance, and lowers costs. The Universal Chiplet Interconnect Express standard, developed by industry leaders, supports these efforts by enabling different dies, or chiplets, to work together smoothly. Various structures based on this standard, such as standard 2-D organic substrate, 2.5-D through-silicon via interposer, Fanout redistribution layer organic interposer, and 3-D hybrid bonding, have been suggested. Despite the benefits, die integration faces challenges due to dense and intricate connections. This article focuses on achieving effective die-to-die connectivity using organic and advanced packaging. These patterns have been validated through simulations and the fabrication of the test chip.