A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy peeling and Excellent TTV for 3DIC

Hybrid bonding has key advantages such as increasing the I/D bandwidth, reducing signal delay, interconnect power loss, and etc., for next generation High Performance Computing (HPC) requirements. In fact, it hybrid bonding process require the high technical hurdle, there is still a challenge that it needs high temperature such as 250–300 degC for Cu-Cu diffusion. Therefore, not only process equipment but also process materials are required to have high thermal resistance. In this paper, a Temporary Bonding De-Bonding (TBDB) tape which has “thermal resistance over 300 degC” and “easy peeling from the organic passivation” is introduced. Furthermore, it has “excellent total thickness variation (TTV)” that can provide the planarization of bonding surface with perform reliable hybrid bonding.