Enhancing Printed Circuit Board (PCB) Electrical Characteristics under Immersion Cooling Condition

In recent years, as power consumption in data centers has escalated, immersion cooling technology has garnered increasing attention due to its potential to significantly enhance cooling efficiency across various application scenarios. Liquids, which exhibit higher thermal conductivity compared to air, enable systems to more effectively dissipate heat from sources, thereby lowering the ambient temperature. Additionally, immersion cooling systems can distribute heat more uniformly, helping to minimize the formation of hot spots. This uniform heat distribution is particularly crucial for various system components, especially high-speed interconnected PCBs [1]. This research primarily focuses on comparing the ambient temperatures of PCBs under immersion cooling conditions with those of PCBs under traditional air cooling, aiming to enhance the electrical characteristics of PCBs and improve system channel design in immersion cooling environments.