The Evaluation of Thermal Performance on Fan Out POP Package

The innovative advantages of advanced packaging bring unprecedented opportunities to an increasingly competitive market. In particular, the changes in appearance size and electrical advantages provide customers with high-quality solutions and support customers in realizing more efficient interconnection of everything. As 5G becomes mainstream, speed and efficiency greatly improve the quality of human life, so there is an increasing demand for complex applications that rely on ultra-low latency. Such as FO-PoP packaging structure is the most advanced vertically integrated integration technology. It also brings thermal performance request and have challenge when two packages stacking or memory start to dissipate heat. Following paper statement will simulation some circumstance to validate package performance before real product implementation. According to design on advanced silicon node wafer with package stacking on package and high power application which aims to high thermal package solution. This paper is to present thermal dissipation analysis of FO-PoP packaging. By using thermal simulation modeling to figure out factors for different die thickness circumstances. Through DOE to compare and explore different combinations with relative die thickness and high thermal DAF (die attach film) and compound is conducted to get optimum package architecture to measure theta Jc temperature, to conclude the best thermal performance.