Optimizing PCB Design with Advanced Copper Foil and Superior Oxide Treatment

This study investigates the optimization of PCBs for high-frequency applications by proposed advanced copper foils with ultra-low-loss materials under different oxide treatments. Focusing on minimizing insertion loss, which is crucial for maintaining signal integrity in high-speed interconnects, the research highlights the effectiveness of non-etching treatments for these advanced copper foil. These treatments significantly improve electrical performance by reducing surface roughness and insertion loss, particularly at frequencies of 16GHz and 28GHz. The findings emphasize the importance of selecting appropriate copper treatments to enhance the performance and design flexibility of high-frequency PCBs in datacenter and AI platforms.