Thermal Simulations and Characterization of High-Power LED Boards

High-power light-emitting diodes (LEDs) are pivotal in modern lighting applications, especially in automotive systems. However, thermal management remains a critical challenge, hence this study focuses on thermal simulation and characterization of high-power LED boards to optimize thermal design and enhance reliability. We employed computational fluid dynamics (CFD) simulations to model heat dissipation mechanisms in LED assemblies, considering various placements for the components in case of natural cooling. Key parameters, including junction temperature and thermal distribution, were evaluated. This study underscores the importance of integrated thermal management solutions in high-power LED systems and provides a robust framework for future design improvements.