A Highly Integrated Multi-Channel Receiver for X Band Applications

This paper proposes a highly integrated multi-channel receiver for X band applications. This receiver adopts system-in-package (SIP) RF Front-end and SIP to board level integration, achieving highly miniaturization and lightweight. With co-simulation of field and circuit, this multi-channel receiver is designed and developed. The results show that the gain of the multi-channel receiver is $40+2\text{dB}$, the noise factor (NF) is better than 6dB, and the isolation between different channels is superior to 50dB. This method can be extended and applied to S to Ka band.