Inverse Order Packaging (invPack): Power Module Packaging Technique using Standard Fabrication Processes and Achieving Improved Performance at Lower Cost

This paper presents the inverse order packaging (invPack) technique, where compared to the conventional power module structure, the substrate and baseplate positions are inverted. This inversion allows the semiconductor dies to be directly attached to a thick heat-spreading material improving the thermal performance. Additionally, using in-house-developed reduced-order simulation software, a large number of fast finite element method (FEM) simulations were conducted to optimize and compare the invPack and the conventional concept. The simulation results indicate that in addition to achieving better steady state and transient thermal performance, the invPack technique can reduce the cost and size of power modules when using inexpensive Aluminum Oxide $(Al_{2}O_{3})$ ceramic substrates.