Analysis of Cu-Edge on Delamination Strength of Cu-Stabilized REBCO Tapes During Transverse Tension Test Using Anvil Method

REBCO-coated conductor (CC) tapes in superconducting devices, such as high-field magnets and coils, experience various stresses, including radial transverse tensile stress from Lorentz forces. This stress can cause delamination, compromising the tape's layered structure and potentially leading to device failure. The Cu stabilizer in CC tapes plays a crucial role in maintaining structural integrity by binding constituent layers with different properties, especially addressing the mismatch in the coefficient of thermal expansion. However, the role of Cu layers in resisting delamination remains unclear. In this study, anvil tests under transverse tension and numerical simulations were performed to investigate the delamination strength of REBCO CC tapes with varying Cu stabilizer thicknesses. CC tapes with Cu edges and those where the edge Cu layers were manually removed were compared, revealing the weakest interlayer. Numerical simulations helped understand the impact of Cu-edges on stress distribution during the anvil test. The findings clarify the role of Cu edges in delamination behavior and offer insights to improve the design and fabrication of more durable superconducting devices.