Noncontact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects

This letter presents an innovative noncontact packaging technique for photonic integrated circuits (PICs) and electronic integrated circuits (EICs) through inductively coupled interconnects. The primary aim of this approach is to enhance thermal isolation between the heat-generating electrical logic die and the thermally sensitive optical interferometer die. The feasibility of this contactless transceiver, which fulfills information transmission from the laser Doppler vibrometry (LDV) to the EIC, is substantiated via electromagnetic simulations. Furthermore, thermal simulations conducted by COMSOL prove that this packaging configuration could potentially reduce the temperature of PICs by up to $4.6~^{\circ }$ C when compared to the conventional 3-D stack packaging, underlining its potential for improved thermal performance.