Characterization of Thermal Behavior of Lead-Free SAC305 Solder for Optimal Manufacturing in Soldering Processes

Manufacturing electronic assemblies with lead-free solder joints poses challenges for the applicable thermal cycles. Optimal thermal cycles contain heating and cooling rates which will keep the integrity of the solder, for extended lifetimes. In this work, lead-free solder alloys of SAC305 composition was characterized for its thermal behavior through solidification experiments on a temperature controlled hot plate and in a DSC experiment. It was shown that heating/cooling rates may have detrimental effect of the integrity of the solder.