A Contactless LSI Test Method Utilizing Direct Emission From On-Chip Interconnects

This paper proposes a method to perform the LSI test without applying a bunch of micro needles to the I/O PADs. LSI test is cost consuming because of expensive test fixtures with multi-pin contacts. In terms of actual operation phases, irradiation side-channel attack as well as electro-magnetic noise radiation is one of the major concerns, however, we propose a method to achieve contactless LSI tests intentionally making use of these radiation phenomena during the test. To make this possible, we implement carrier wave generators to transport results from BISTs and then designate on-die antennas by utilizing portions of on-chip signal routing patterns on 5 mm × 5 mm LSI TEG. Preliminarily, we carry out the time domain and an FEM simulation, and moreover, the experimental results of LSI TEG show that practical 2.5 GHz and 84 MHz emissions are achieved by using a common EMI probe.