An Overview of Mechanical Characterization for Power Module: Challenges, Advances, and Future Prospects

Driven by advancements in the semiconductor technology, especially silicon carbide, numerous packaging designs have been developed to meet demands of various applications. Prior to the market release, the reliability of these power modules must be comprehensively assessed. The mechanical characterization is an essential measure to assess the reliability of the power module due to its direct relation to the power module failure. The mechanical distribution and differences, typically on the submicron scale, pose significant measurement challenges. Therefore, achieving accurate sampling of the mechanical information without compromising the functionality and integrity of the power module remains a relentless pursuit in the mechanical characterization. In this article, a comprehensive review of state-of-the-art methodologies for the mechanical characterization of the power module is presented, including both direct and noncontact methods. The deformation mechanisms and associated measurement challenges are analyzed. Various measurement techniques are systematically compared and their advantages and disadvantages are highlighted. In addition, the utilization of the mechanical data in existing applications is discussed, and potential future research directions are discussed. This review may provide insights into the future development and deployment of the power module.