An Efficient SPICE-compatible Model for Fast Co-simulation of Signal and Power Integrity on Multilayer PCB with Arbitrary Shape

This paper presents the SPICE-compatible model to efficiently simulate and analyze the multilayer PCBs with arbitrarily shaped plates, signal/power/ground vias, and multi-coupled traces. This model is compared and evaluated using full-wave simulation. The results demonstrate that the proposed model significantly reduces computational time while maintaining high accuracy for complex PCB designs, achieving high efficiency.