PCB Layout Design Using Finite Element Analysis for Parasitic Inductance Reduction

This paper presents a methodology employing Finite Element Analysis (FEA) simulation to evaluate parasitic elements in two distinct PCB layouts of 1000 W full-bridge power inverters designed with SMD-based components. The study compares a two-layer PCB (Layout 1) with a four-layer PCB (Layout 2), where the latter features a reduced spacing of 0.196 mm between conductive planes. The results show that the reduced spacing in Layout 2 leads to an increase in capacitance and a significant reduction of approximately 59.46% in AC inductance. This methodology is adaptable for different power converters and PCB layouts, enabling designers to optimize mechanical dimensions, component arrangements, and configurations before prototyping.